Honor Society® member
Rohan Dengle
applications engineer/ spec 2 at Microchip Technology
- executive master of business administration
- Class of 2026
- Vestal, New York
Member since May 2025
About
My name is Rohan Dengle, and I work as an Application Engineer-II at Microchip Technology while pursuing my MBA with a perfect GPA. I work with FPGA-based systems and embedded solutions because they combine my electrical engineering knowledge with my innovation interests. My worldwide perspective and unceasing growth motivation come from my transition between Mumbai and Binghamton in New York. I aim to connect engineering with strategic leadership through my projects, which include developing university-featured smart baseball bats and leading cross-functional technology teams. My membership in the Honor Society demonstrates my dedication to excellence, integrity, and purposeful impact.
Education
-
suny at binghamton
electrical engineering
2021 – 2023
Goals and interests
- Career goal
Technical Product Manager
Systems Engineering Lead
Director of Engineering
Product Strategy
VP of Engineering
CTO
VP of Product- Graduate school interests
University of the Cumberlands
- Outside the classroom
Tennis
Guitar
Reading
Cricket
Music
Experience
-
applications engineer/ spec 2
Microchip Technology
Jul 2023 – May 2025
Languages
- German Intermediate
- French (France) Intermediate
