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Portrait of Rohan Dengle

Honor Society® member

Rohan Dengle

applications engineer/ spec 2 at Microchip Technology

  • executive master of business administration
  • Class of 2026
  • Vestal, New York

Member since May 2025

About

My name is Rohan Dengle, and I work as an Application Engineer-II at Microchip Technology while pursuing my MBA with a perfect GPA. I work with FPGA-based systems and embedded solutions because they combine my electrical engineering knowledge with my innovation interests. My worldwide perspective and unceasing growth motivation come from my transition between Mumbai and Binghamton in New York. I aim to connect engineering with strategic leadership through my projects, which include developing university-featured smart baseball bats and leading cross-functional technology teams. My membership in the Honor Society demonstrates my dedication to excellence, integrity, and purposeful impact.

Education

  • suny at binghamton

    electrical engineering

    2021 – 2023

Goals and interests

Career goal

Technical Product Manager
Systems Engineering Lead
Director of Engineering
Product Strategy
VP of Engineering
CTO
VP of Product

Graduate school interests

University of the Cumberlands

Outside the classroom

Tennis
Guitar
Reading
Cricket
Music

Experience

  • applications engineer/ spec 2

    Microchip Technology

    Jul 2023 – May 2025

Languages

  • German Intermediate
  • French (France) Intermediate